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VERSION:2.0
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UID:beca8ca33da77479cd0bcd0fdb781999
DTSTAMP:20260621T105304Z
DTSTART:20230628T160000
DTEND:20230628T170000
LOCATION:Online, ,  
DESCRIPTION:Based on the current state of integration technologies, our webinar shows possible integration approaches for chiplet-based multi-die systems to build future sensor fusion platforms, e.g. for ADAS and AGV applications. Furthermore, we discuss current ... \r\nhttps://t3.silicon-saxony.de/nc/termine/event-detail/events-information/event/show/webinar-chiplet-based-sensor-fusion-platform-for-autonomous-driving-and-agvs-an-overview/
X-ALT-DESC;FMTTYPE=text/html:<p><a href="https://t3.silicon-saxony.de/nc/termine/event-detail/events-information/event/show/webinar-chiplet-based-sensor-fusion-platform-for-autonomous-driving-and-agvs-an-overview/">Weitere Informationen</a></p>Based on the current state of integration technologies, our webinar shows possible integration approaches for chiplet-based multi-die systems to build future sensor fusion platforms, e.g. for ADAS and AGV applications. Furthermore, we discuss current and future chip-to-chip standards and their advantages and disadvantages for automotive and AGV applications.<br /><br /><strong>Webinar language: English</strong><br /><br />Event website. ... <p><a href="https://t3.silicon-saxony.de/nc/termine/event-detail/events-information/event/show/webinar-chiplet-based-sensor-fusion-platform-for-autonomous-driving-and-agvs-an-overview/">Weitere Informationen</a></p>
SUMMARY:Webinar: Chiplet-based sensor fusion platform for autonomous driving and AGVs – an Overview
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